IP Library Assignment 032412/0236
Patent Assignment
Reel/Frame 032412/0236

Assignment of Assignor's Interest

Recorded: 2014-03-12 Pages: 4
Assignors
WE, HONG BOK
Executed: 2014-03-04
KIM, DONG WOOK
Executed: 2014-03-05
LEE, JAE SIK
Executed: 2014-03-04
GU, SHIQUN
Executed: 2014-03-05
Assignee
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE, SAN DIEGO, CALIFORNIA, 92121-1714
Covered Property (1)
Substrate with Conductive Vias
Patent: 9,596,768 →
Application: 14/196,481 →
Publication: US 2015/0257282