IP Library Assignment 032416/0700
Patent Assignment
Reel/Frame 032416/0700

Assignment of Assignor's Interest

Recorded: 2014-03-12 Pages: 2
Assignor
CHEN, HSIEN-WEI
Executed: 2014-03-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Packages with Through-Vias Having Tapered Ends
Patent: 9,735,134 →
Application: 14/206,248 →
Publication: US 2015/0262909
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →