Patent Assignment
Reel/Frame 032428/0961
Assignment of Assignor's Interest
Recorded: 2014-03-13
Pages: 4
Assignee
ALPHA DESIGN CO., LTD.
2211-3, SHIGENO-KOU, TOUMI-SHI,, NAGANO, 389-0513, JAPAN
Covered Property
(1)
Electronic Component Bonding Method