IP Library › Assignment 032430/0054
Patent Assignment
Reel/Frame 032430/0054

Assignment of Assignor's Interest

Recorded: 2014-03-13 Pages: 4
Assignors
LEE, LI-GUO
Executed: 2014-02-07
LIU, YUNG-SHENG
Executed: 2014-02-07
LIU, YI-CHEN
Executed: 2014-02-07
LAI, YI-JEN
Executed: 2014-02-07
CHEN, CHUN-JEN
Executed: 2014-02-13
CHENG, HSI-KUEI
Executed: 2014-02-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Bump Structure and Method for Forming the Same
Application: 14/208,744 →
Publication: US 2015/0262951
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →