Patent Assignment
Reel/Frame 032445/0824
Assignment of Assignor's Interest
Recorded: 2014-03-14
Pages: 2
Assignor
TING, CHIH-YUAN
Executed: 2014-03-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Via Corner Engineering in Trench-First Dual Damascene Process