Patent Assignment
Reel/Frame 032464/0814
Assignment of Assignor's Interest
Recorded: 2014-03-18
Pages: 3
Assignors
JIANG, HONGJIN
Executed: 2013-03-20
NALLANI, ARUN KUMAR C.
Executed: 2013-03-21
SIDHU, RAJEN S.
Executed: 2013-03-21
DUDEK, MARTHA A.
Executed: 2013-03-21
TANG, WEIHUA
Executed: 2013-03-20
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
Hybrid Solder and Filled Paste in Microelectronic Packaging