Patent Assignment
Reel/Frame 032482/0175
Assignment of Assignor's Interest
Recorded: 2014-03-20
Pages: 3
Assignors
KOTAKE, TOMOHIKO
Executed: 2014-01-07
NAGAI, SHUNSUKE
Executed: 2014-01-07
HASHIMOTO, SHINTARO
Executed: 2014-01-07
ABE, SHINICHIRO
Executed: 2014-01-07
MIYATAKE, MASATO
Executed: 2014-01-07
TAKANEZAWA, SHIN
Executed: 2014-01-07
MURAI, HIKARI
Executed: 2014-01-07
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Siloxane Compound, Modified Imide Resin, Thermosetting Resin Composition, Prepreg, Film with Resin, Laminated Plate, Multilayer Printed Wiring Board, and Semiconductor Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →