Assignment of Assignor's Interest

Recorded: 2014-03-20 Pages: 5

Assignors

CHI, HEEJO

Executed: 2014-03-18

SHIN, HANGIL

Executed: 2014-03-18

CHO, NAMJU

Executed: 2014-03-18

Assignee

STATS CHIPPAC, LTD.

10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE

Covered Property (1)

Semiconductor Device and Method of Forming 3D Dual Side Die Embedded Build-Up Semiconductor Package

Patent: 9,362,161 →

Application: 14/220,336 →

Publication: US 2015/0270237

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.