Patent Assignment
Reel/Frame 032484/0755
Assignment of Assignor's Interest
Recorded: 2014-03-20
Pages: 3
Assignors
CHOI, KWANG-SEONG
Executed: 2014-01-22
BAE, HYUN-CHEOL
Executed: 2014-01-22
LEE, HAKSUN
Executed: 2014-01-22
EOM, YONG SUNG
Executed: 2014-01-22
Assignee
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
161 GAJEONG-DONG, YUSEONG-GU, DAEJEON, 305-700, KOREA, REPUBLIC OF
Covered Property
(1)
Bonding Structure of Electronic Equipment