Patent Assignment
Reel/Frame 032487/0609
Assignment of Assignor's Interest
Recorded: 2014-03-20
Pages: 2
Assignors
YEH, MING-HSI
Executed: 2011-10-24
TSAI, TSUNG-CHIEH
Executed: 2011-10-25
LEE, CHUN-YI
Executed: 2011-10-31
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Semiconductor Device and Fabrication Method Thereof