Patent Assignment
Reel/Frame 032494/0796
Assignment of Assignor's Interest
Recorded: 2014-03-21
Pages: 9
Assignors
PENG, CHAO-HSIEN
Executed: 2014-03-18
KUO, CHI-LIANG
Executed: 2014-03-18
LEE, MING-HAN
Executed: 2014-03-18
LEE, HSIANG-HUAN
Executed: 2014-03-18
SHUE, SHAU-LIN
Executed: 2014-03-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Via Pre-Fill on Back-End-of-the-Line Interconnect Layer