Patent Assignment
Reel/Frame 032538/0966
Assignment of Assignor's Interest
Recorded: 2014-03-27
Pages: 3
Assignors
DANG, BING
Executed: 2014-03-26
KNICKERBOCKER, JOHN U.
Executed: 2014-03-26
TSANG, CORNELIA KANG-I
Executed: 2014-03-26
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Wafer Debonding Using Mid-Wavelength Infrared Radiation Ablation