Patent Assignment
Reel/Frame 032549/0636
Assignment of Assignor's Interest
Recorded: 2014-03-28
Pages: 4
Assignors
HO, CHENG-YING
Executed: 2014-03-19
CHEN, PAO-TUNG
Executed: 2014-03-19
WANG, WEN-DE
Executed: 2014-03-19
LIU, JEN-CHENG
Executed: 2014-03-19
YAUNG, DUN-NIAN
Executed: 2014-03-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
3DIC Seal Ring Structure and Methods of Forming Same