Patent Assignment
Reel/Frame 032550/0348
Assignment of Assignor's Interest
Recorded: 2014-03-28
Pages: 4
Assignors
HO, MING-CHE
Executed: 2014-02-18
WU, YI-WEN
Executed: 2014-02-18
HWANG, CHIEN LING
Executed: 2014-02-18
KUO, HUNG-JUI
Executed: 2014-02-18
LIU, CHUNG-SHI
Executed: 2014-02-18
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Via Structure for Packaging and a Method of Forming