Patent Assignment
Reel/Frame 032551/0682
Assignment of Assignor's Interest
Recorded: 2014-03-28
Pages: 7
Assignors
CAMACHO, ZIGMUND R.
Executed: 2014-03-26
LIAO, BARTHOLOMEW
Executed: 2014-03-26
ALVAREZ, SHEILA MARIE L.
Executed: 2014-03-26
CHI, HEEJO
Executed: 2014-03-28
DAO, KELVIN
Executed: 2014-03-26
Assignee
STATS CHIPPAC, LTD.
10 ANG MO KIO STREET 65, #05-17/20 TECHPOINT, SINGAPORE, 569059, SINGAPORE
Covered Property
(1)
Semiconductor Device and Method of Forming RDL and Vertical Interconnect by Laser Direct Structuring
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.