IP Library Assignment 032557/0351
Patent Assignment
Reel/Frame 032557/0351

Assignment of Assignor's Interest

Recorded: 2014-03-28 Pages: 7
Assignors
TOYODA, KAZUYUKI
Executed: 2014-02-28
TAKASAKI, TADASHI
Executed: 2014-02-28
ASHIHARA, HIROSHI
Executed: 2014-02-28
SANO, ATSUSHI
Executed: 2014-02-28
AKAE, NAONORI
Executed: 2014-02-28
YANAI, HIDEHIRO
Executed: 2014-02-28
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Patent: 8,925,562 →
Application: 14/229,284 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →