Patent Assignment
Reel/Frame 032560/0135
Assignment of Assignor's Interest
Recorded: 2014-03-31
Pages: 3
Assignors
YAMAZAKI, SHUNPEI
Executed: 2002-12-18
MURAKAMI, MASAKAZU
Executed: 2002-12-17
TAKAYAMA, TORU
Executed: 2002-12-17
MARUYAMA, JUNYA
Executed: 2002-12-17
Assignee
SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
398, HASE, ATSUGI-SHI, KANAGAWA-KEN, 243-0036, JAPAN
Covered Property
(1)
Method for Fabricating a Semiconductor Device by Bonding a Layer to a Support with Curvature