IP Library Assignment 032561/0532
Patent Assignment
Reel/Frame 032561/0532

Assignment of Assignor's Interest

Recorded: 2014-03-28 Pages: 4
Assignors
REN, HE
Executed: 2014-03-20
NAIK, MEHUL B.
Executed: 2014-03-25
CAO, YONG
Executed: 2014-03-20
SHEK, MEI-YEE
Executed: 2014-03-26
CHENG, YANA
Executed: 2014-03-20
KESAPRAGADA, SREE RANGASAI V.
Executed: 2014-03-24
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Dielectric/Metal Barrier Integration to Prevent Copper Diffusion
Patent: 9,601,431 →
Application: 14/173,807 →
Publication: US 2015/0221596