Assignment of Assignor's Interest

Recorded: 2014-04-01 Pages: 2

Assignor

KUISMA, HEIKKI

Executed: 2014-02-26

Assignee

MURATA ELECTRONICS OY

MYLLYNKIVENKUJA 6, VANTAA, 01621, FINLAND

Covered Property (1)

Method of Making a System-in-Package Device

Patent: 9,184,131 →

Application: 14/127,580 →

Publication: US 2014/0217615

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.