Patent Assignment
Reel/Frame 032593/0808
Assignment of Assignor's Interest
Recorded: 2014-04-03
Pages: 4
Assignors
YU, CHEN-HUA
Executed: 2014-03-28
JENG, SHIN-PUU
Executed: 2014-03-28
YEH, DER-CHYANG
Executed: 2014-03-28
CHEN, HSIEN-WEI
Executed: 2014-03-21
CHEN, JIE
Executed: 2014-03-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Packages with Metal Line Crack Prevention Design