Patent Assignment
Reel/Frame 032598/0021
Assignment of Assignor's Interest
Recorded: 2014-04-03
Pages: 5
Assignors
HUNG, WENSEN
Executed: 2014-03-18
HUANG, SZU-PO
Executed: 2014-03-18
LEE, HSIANG-FAN
Executed: 2014-03-18
CHEN, KIM HONG
Executed: 2014-03-19
WU, CHI-HSI
Executed: 2014-03-19
JENG, SHIN-PUU
Executed: 2014-03-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Package with Embedded Heat Dissipation Features