Patent Assignment
Reel/Frame 032598/0673
Assignment of Assignor's Interest
Recorded: 2014-04-03
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Bonding Structure for Stacked Semiconductor Devices