Patent Assignment
Reel/Frame 032616/0139
Assignment of Assignor's Interest
Recorded: 2014-04-07
Pages: 3
Assignee
SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
398, HASE, ATSUGI-SHI, KANAGAWA-KEN, 243-0036, JAPAN
Covered Property
(1)
Method of Semiconductor Device Including Step of Cutting Substrate at Opening of Insulating Layer