Patent Assignment
Reel/Frame 032617/0550
Assignment of Assignor's Interest
Recorded: 2014-04-07
Pages: 6
Assignors
GANESAN, SANKA
Executed: 2013-06-11
QIAN, ZHIGUO
Executed: 2013-06-11
SANKMAN, ROBERT L.
Executed: 2013-06-11
SRINIVASAN, KRISHNA
Executed: 2013-06-11
ZHU, ZHAOHUI
Executed: 2014-02-03
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
High Density Package Interconnects
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.