IP Library › Assignment 032625/0183
Patent Assignment
Reel/Frame 032625/0183

Assignment of Assignor's Interest

Recorded: 2014-04-08 Pages: 5
Assignors
KIM, YONG-HOON
Executed: 2014-02-03
LEE, HEE-SEOK
Executed: 2014-02-03
JEONG, JIN-HA
Executed: 2014-04-03
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, KOREA, REPUBLIC OF
Covered Property (1)
Semiconductor Package
Patent: 9,362,235 →
Application: 14/173,119 →
Publication: US 2014/0151859