Patent Assignment
Reel/Frame 032626/0406
Assignment of Assignor's Interest
Recorded: 2014-04-08
Pages: 5
Assignors
OSSIMITZ, PETER
Executed: 2014-04-01
SCHAEFER, JUERGEN
Executed: 2014-04-01
CHEN, LIU
Executed: 2014-04-01
DINKEL, MARKUS
Executed: 2014-04-01
MACHEINER, STEFAN
Executed: 2014-04-01
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-12, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Overmolded substrate-chip arrangement with heat sink