Assignment of Assignor's Interest

Recorded: 2014-04-08 Pages: 2

Assignors

KIM, JANG SOON

Executed: 2014-03-25

CHO, HYUN JU

Executed: 2014-03-25

SEO, JU YONG

Executed: 2014-03-25

Assignee

LG HAUSYS, LTD.

ONE IFC, 10 GUKJEGEUMYUNG-RO, YEONGDEUNGPO-GU, SEOUL, 150-721, KOREA, REPUBLIC OF

Covered Property (1)

Adhesive Film Having Good Machinability for Protecting the Surface of a Semiconductor Wafer

Application: 14/350,445 →

Publication: US 2014/0272401

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.