Patent Assignment
Reel/Frame 032632/0605
Assignment of Assignor's Interest
Recorded: 2014-04-09
Pages: 6
Assignors
LEE, JOON-SUK
Executed: 2014-03-17
LEE, WOONG
Executed: 2014-03-17
LIM, HUN-HYEONG
Executed: 2014-03-17
HWANG, KI-HYUN
Executed: 2014-03-17
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Three Dimensional Semiconductor Memory Device