Patent Assignment
Reel/Frame 032641/0121
Assignment of Assignor's Interest
Recorded: 2014-04-09
Received: 2014-04-09
Pages: 38
Assignor
TELEFUNKEN SEMICONDUCTORS GMBH & CO. KG
Executed: 2013-11-25
Assignee
TELEFUNKEN SEMICONDUCTORS GMBH
THERESIENSTRASSE 2, ANNETTE NICKERSON, HEILBRONN, DEX, 74072, GERMANY
Covered Properties
(8)
Amplifier Circuit
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11/819,134 →
Method for Producing Deep Trench Structures
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11/812,386 →
Lateral Dmos Transistor and Method for the Production Thereof
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11/730,514 →
Method for Manufacturing a Metal-Semiconductor Contact in Semiconductor Components
Application:
11/447,094 →
Process for Manufacturing a Dmos Transistor
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10/167,960 →
Method for Manufacturing Buried Areas
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10/145,013 →
Method for Manufacturing Components on an Soi Wafer
Application:
10/145,172 →
Method for Manufacturing a Silicon Wafer
Application:
10/145,169 →