IP Library Assignment 032641/0121
Patent Assignment
Reel/Frame 032641/0121

Assignment of Assignor's Interest

Recorded: 2014-04-09 Received: 2014-04-09 Pages: 38
Assignor
Assignee
TELEFUNKEN SEMICONDUCTORS GMBH
THERESIENSTRASSE 2, ANNETTE NICKERSON, HEILBRONN, DEX, 74072, GERMANY
Covered Properties (8)
Amplifier Circuit
Application: 11/819,134 →
Method for Producing Deep Trench Structures
Application: 11/812,386 →
Lateral Dmos Transistor and Method for the Production Thereof
Application: 11/730,514 →
Method for Manufacturing a Metal-Semiconductor Contact in Semiconductor Components
Application: 11/447,094 →
Process for Manufacturing a Dmos Transistor
Application: 10/167,960 →
Method for Manufacturing Buried Areas
Application: 10/145,013 →
Method for Manufacturing Components on an Soi Wafer
Application: 10/145,172 →
Method for Manufacturing a Silicon Wafer
Application: 10/145,169 →