Patent Assignment
Reel/Frame 032644/0906
Assignment of Assignor's Interest
Recorded: 2014-04-10
Pages: 2
Assignor
NAKAJIMA, TSUNEHIRO
Executed: 2014-04-04
Assignee
FUJI ELECTRIC CO., LTD.
1-1 TANABESHINDEN, KAWASAKI-KU, KAWASAKI-SHI, 210-9530, JAPAN
Covered Property
(1)
Wafer Support System and Method for Separating Support Substrate from Solid-Phase Bonded Wafer and Method for Manufacturing Semiconductor Device