Patent Assignment
Reel/Frame 032656/0705
Assignment of Assignor's Interest
Recorded: 2014-04-11
Pages: 6
Assignors
CRISP, RICHARD DEWITT
Executed: 2012-04-02
ZOHNI, WAEL
Executed: 2012-04-02
HABA, BELGACEM
Executed: 2012-04-02
LAMBRECHT, FRANK
Executed: 2012-04-02
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Microelectronic Assembly Including Memory Packages Connected to Circuit Panel, the Memory Packages Having Stub Minimization for Wirebond Assemblies Without Windows
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 10, 2014
From: CRISP, RICHARD DEWITT; ZOHNI, WAEL; HABA, BELGACEM; LAMBRECHT, FRANK
To: INVENSAS CORPORATION
Reel/Frame 032647/0689 →
Assignment of Assignor's Interest
Apr 14, 2014
From: CRISP, RICHARD DEWITT; ZOHNI, WAEL; HABA, BELGACEM; LAMBRECHT, FRANK
To: INVENSAS CORPORATION
Reel/Frame 032666/0299 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Change of Name
Nov 24, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073689/0786 →
Change of Name
Nov 24, 2025
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 073689/0754 →