Patent Assignment
Reel/Frame 032673/0121
Assignment of Assignor's Interest
Recorded: 2014-04-15
Pages: 4
Assignors
HUANG, CHIH-HUI
Executed: 2014-01-16
TSAO, CHUN-HAN
Executed: 2014-01-16
CHEN, SHENG-CHAU
Executed: 2014-01-16
TU, YEUR-LUEN
Executed: 2014-01-16
TSAI, CHIA-SHIUNG
Executed: 2014-01-16
CHEN, XIAOMENG
Executed: 2014-01-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Wafer Processing Method and Apparatus