Patent Assignment
Reel/Frame 032694/0194
Assignment of Assignor's Interest
Recorded: 2014-04-15
Pages: 2
Assignor
DO, EUN HYE
Executed: 2014-03-19
Assignee
SK HYNIX INC.
2091, GYEONGCHUNG-DAERO, BUBAL-EUB, ICHEON-SI GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate for Semiconductor Package and Semiconductor Package Having the Same