Patent Assignment
Reel/Frame 032726/0008
Assignment of Assignor's Interest
Recorded: 2014-04-22
Pages: 4
Assignors
JENG, SHIN-PUU
Executed: 2014-04-10
CHIOU, WEN-CHIH
Executed: 2014-04-10
YU, TU-HAO
Executed: 2014-04-10
TU, HUNG-JUNG
Executed: 2014-04-10
LIN, YU-LIANG
Executed: 2014-04-10
WANG, SHIH-HUI
Executed: 2014-04-10
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices