Patent Assignment
Reel/Frame 032729/0977
Assignment of Assignor's Interest
Recorded: 2014-04-22
Pages: 2
Assignor
CHEN, DA-JUNG
Executed: 2014-03-07
Assignee
DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD
4 KAKI BUKIT AVENUE 1, #05-04, 417939, SINGAPORE
Covered Property
(1)
Package Structure with Direct Bond Copper Substrate