Patent Assignment
Reel/Frame 032730/0569
Assignment of Assignor's Interest
Recorded: 2014-04-22
Pages: 4
Assignors
YOON, SUN HO
Executed: 2014-04-07
CHO, HANG KYU
Executed: 2014-04-08
JEONG, HAN SOUNG
Executed: 2014-04-08
KIM, HYO JUNG
Executed: 2014-04-08
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Ceramic Electronic Component, Manufacturing Method Thereof and Board Having the Same Mounted Thereon