Patent Assignment
Reel/Frame 032731/0752
Assignment of Assignor's Interest
Recorded: 2014-04-22
Pages: 4
Assignor
CHOI, MIN SUNG
Executed: 2014-04-03
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Electronic Component and Method of Manufacturing the Same