Patent Assignment
Reel/Frame 032732/0721
Assignment of Assignor's Interest
Recorded: 2014-04-23
Pages: 6
Assignors
HWANG, YOO-SANG
Executed: 2014-04-16
CHUNG, HYUN-WOO
Executed: 2014-04-11
KIM, DAE-IK
Executed: 2014-04-16
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same