Patent Assignment
Reel/Frame 032733/0513
Assignment of Assignor's Interest
Recorded: 2014-04-23
Pages: 2
Assignors
MIYAUCHI, KAZUHIRO
Executed: 2014-01-27
SUZUKI, NAOYA
Executed: 2014-01-27
TAKANO, NOZOMU
Executed: 2014-02-07
YAMASHITA, YUKIHIKO
Executed: 2014-01-29
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Reflow Film, Solder Bump Formation Method, Solder Joint Formation Method, and Semiconductor Device
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →