IP Library Assignment 032761/0269
Patent Assignment
Reel/Frame 032761/0269

Assignment of Assignor's Interest

Recorded: 2014-04-25 Pages: 6
Assignors
JEZEWSKI, CHRISTOPHER J.
Executed: 2013-12-23
MICHALAK, DAVID J.
Executed: 2013-12-23
SINGH, KANWAL JIT
Executed: 2013-12-23
MYERS, ALAN M.
Executed: 2013-12-23
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Techniques for Forming Interconnects in Porous Dielectric Materials
Patent: 9,406,615 →
Application: 14/139,970 →
Publication: US 2015/0179578
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 15, 2022
From: INTEL CORPORATION
To: TAHOE RESEARCH, LTD.
Reel/Frame 061175/0176 →