Patent Assignment
Reel/Frame 032764/0628
Assignment of Assignor's Interest
Recorded: 2014-04-27
Pages: 5
Assignors
QIN, FEI
Executed: 2014-01-15
XIA, GUOFENG
Executed: 2014-01-15
AN, TONG
Executed: 2014-01-15
LIU, CHENGYAN
Executed: 2014-01-15
WU, WEI
Executed: 2014-01-15
ZHU, WENHUI
Executed: 2014-01-15
Assignee
BEIJING UNIVERSITY OF TECHNOLOGY
100 # PINGLEYUAN, CHAOYANG DISTRICT, BEIJING, 100124, CHINA
Covered Property
(1)
Fcoc (Flip Chip on Chip) Package and Manufacturing Method Thereof