Patent Assignment
Reel/Frame 032774/0864
Assignment of Assignor's Interest
Recorded: 2014-04-29
Pages: 6
Assignors
CHUNG, HYUNSOO
Executed: 2014-03-14
KIM, JONGYEON
Executed: 2014-03-18
LEE, IN-YOUNG
Executed: 2014-03-11
CHO, TAE-JE
Executed: 2014-03-19
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Packages Having Through Electrodes and Methods of Fabricating the Same