IP Library › Assignment 032775/0056
Patent Assignment
Reel/Frame 032775/0056

Assignment of Assignor's Interest

Recorded: 2014-04-29 Pages: 5
Assignors
TSAI, SHUANG-JI
Executed: 2014-03-25
YAUNG, DUN-NIAN
Executed: 2014-04-03
LIU, JEN-CHENG
Executed: 2014-03-25
WANG, WEN-DE
Executed: 2014-03-25
LIN, JENG-SHYAN
Executed: 2014-03-25
HO, CHENG-YING
Executed: 2014-03-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property (1)
Semiconductor Device Having a Bonding Pad and Shield Structure and Method of Manufacturing the Same
Patent: 9,142,690 →
Application: 14/215,296 →
Publication: US 2014/0199804
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Aug 5, 2024
From: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
To: PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC
Reel/Frame 068326/0474 →