IP Library › Assignment 032783/0704
Patent Assignment
Reel/Frame 032783/0704

Assignment of Assignor's Interest

Recorded: 2014-04-29 Pages: 8
Assignors
SHEARER, CATHERINE
Executed: 2014-03-21
MATTHEWS, MICHAEL C
Executed: 2014-04-17
MATTURRI, PETER A
Executed: 2014-03-21
BARBER, EUNSOOK
Executed: 2014-03-21
WEAVER, RICHARD
Executed: 2014-03-26
Assignee
ORMET CIRCUITS, INC.
6555 NANCY RIDGE DRIVE, STE 200, SAN DIEGO, CALIFORNIA, 92121
Covered Property (1)
Semiconductor Packaging Containing Sintering Die-Attach Material
Patent: 9,583,453 →
Application: 13/906,317 →
Publication: US 2014/0131898