IP Library Assignment 032791/0073
Patent Assignment
Reel/Frame 032791/0073

Assignment of Assignor's Interest

Recorded: 2014-04-30 Pages: 5
Assignors
HIROCHI, YUKITOMO
Executed: 2014-02-17
OHASHI, NAOFUMI
Executed: 2014-02-17
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Substrate Processing Apparatus and Method of Manufacturing Semiconductor Device
Patent: 9,018,689 →
Application: 14/230,513 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →