IP Library › Assignment 032793/0582
Patent Assignment
Reel/Frame 032793/0582

Assignment of Assignor's Interest

Recorded: 2014-04-30 Pages: 4
Assignors
ROSS, JORDAN PETER
Executed: 2014-04-25
HARTNETT, AMANDA M.
Executed: 2014-04-15
JARRETT, ROBERT NORMAN
Executed: 2014-04-28
Assignee
INDIUM CORPORATION
34 ROBINSON ROAD, CLINTON, NEW YORK, 13323
Covered Property (1)
Low Void Solder Joint for Multiple Reflow Applications
Patent: 9,468,136 →
Application: 14/157,352 →
Publication: US 2014/0193658