Patent Assignment
Reel/Frame 032801/0524
Assignment of Assignor's Interest
Recorded: 2014-05-01
Pages: 6
Assignors
LEE, JANG-WOO
Executed: 2014-04-14
SHIM, JONG-BO
Executed: 2014-04-16
CHOI, KYOUNG-SEI
Executed: 2014-04-14
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Stack Type Semiconductor Package