Patent Assignment
Reel/Frame 032809/0377
Assignment of Assignor's Interest
Recorded: 2014-05-02
Pages: 4
Assignors
CHIEN, VOLUME
Executed: 2014-03-27
CHENG, YU-HENG
Executed: 2014-03-27
TSAI, FU-TSUN
Executed: 2014-04-03
LIN, HUAN-EN
Executed: 2014-04-01
JENG, CHI-CHERNG
Executed: 2014-04-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Deep Trench Isolation with Air-Gap in Backside Illumination Image Sensor Chips