Patent Assignment
Reel/Frame 032816/0468
Assignment of Assignor's Interest
Recorded: 2014-05-05
Pages: 3
Assignor
LIN, CHIU-SHUN
Executed: 2014-04-09
Assignee
HIMAX TECHNOLOGIES LIMITED
NO.26, ZIH LIAN ROAD, FONGHUA VILLAGE, XINSHI DIST., TAINAN CITY, TAIWAN
Covered Property
(1)
Metal Bump Structure for Use in Driver Ic and Method for Forming the Same