Patent Assignment
Reel/Frame 032831/0895
Assignment of Assignor's Interest
Recorded: 2014-05-06
Pages: 4
Assignee
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OHTEMACHI 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Temporary Adhesive Material for Wafer, Film for Temporary Adhesion Using Same, Wafer Processing Laminate, and Method for Producing Thin Wafer Using Same